BETWEEN was present at the INDUFORUM job fair held on 28 and 29 March at Madrid’s Higher Technical School of Industrial Engineers. The aim of the event was, once again, to meet new talents and establish new links between the academic and professional worlds.
A great number of university students and graduates visited BETWEEN’s booth during the event. Industrial Engineering (electrical and mechanical), Chemical Engineering and Civil Engineering were the most frequent profiles among the visitors to our Betweener booth.
A significant part of attendees recognised our company, which they had seen on different employment portals, indicating that students start early to familiarise themselves with the job situation in their field.
Although many attendees enquired about applying for internship programmes – which we do not offer at BETWEEN – we had the opportunity of making initial contact with the new generations of Engineers from Madrid’s Higher Technical School of Industrial Engineers.
At the booth, which was very busy until late in the afternoon, various merchandising items were handed out to all the young engineers who came to learn about us, so they will have something to remember BETWEEN by wherever they go.
Induforum, where participating companies also included Accenture, Amazon, ICEX, Ferrrovial, CLH, Dynatic, Vodafone, HP, EY, Segula and Thales, among others, is one of the many talent recruitment initiatives that we carry out every year, and which we intend to continue expanding year after year.
